Saw Chipping Improvement to Achieve Defect Free Bare
2014-11-3 · grit blade. (courtesy of Disco) Fig. 5 : Readiness of diamond exposure. (Courtesy of Disco) The combined factors exhibited very positive results, whereby there was no occurrence of severe backside chipping. With details measurement, all backside chipping sizes was less than 15um. Fig. 6 : Results of wafer sawing with combination of new
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